Your cart is empty

Silicone Thermal Conductive Pad 40cm x 20cm x 1mm

$5.00
PayPal Acceptance Mark
Specifications:

Thermal pad /thermal gap filler pad/thermal conductive pad

Applications:

- Between electronic components such as Semiconductor, IC, CPU, MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, Wireless Hub, Power supply etc.
- Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink.

Specification Sheet:

 

Properties Units Metric Value Test Method
Construction & Composition  ---- Silicone & Fiberglass ----
Color  ---- white Visual
Thickness Range mm 0.3~10 ----
Hardness  Shore C A 15~35 ASTM D2240
Density  g/cc 1.8±0.1 ASTM D792
Tensile Strength  Kgf/cm2 >180 ASTM D412
Elongation  % 60% ASTM D412
Continuous Use Temp  °C -40 to 220 EN344
Breakdown Voltage  Kv/mm ≥4.0 ASTM D149
Volume Impedance ohm-cm 1.0*1011 ASTM D257
Dielectric Constant 1MHz 5.27 ASTM D150
Weight Damnify  ---- ≤1 @150°C 240H
Flame Rating ---- V-0 UL 94
Thermal Conductivity  W/m.k 1.2±0.2 ASTM E1461
UL, RoHS, REACH ---- Compliance ----

Add to Cart:

  • Shipping Weight: 0.17kg
  • 334 Units in Stock