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LY IR 6000 BGA Rework Station

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IR6000 BGA Rework Station is designed to meet the increasing everchanging demands of today`s fast BGA Rework environments (R).

Products apply to the welding of CBGA CCGA CSP QFN MLF PGA, all the green epoxy type BGA chip and other special parts such as metal shielding cover, plastic connector replacement of various and soft PCB.

Machine comes along with Manual and video demonstration CD-ROM,The information is easy to understand. Even if you have never engaged in BGA rework , it can be quickly mastered the technology。

You'll find its really the machine you need by its high integration Design, the smaller workbench, non-mixed cables and the convenient operation –all the process of soldering controlled by a button. Machine overall system integration Design, Rework station more integrated workbench area by area occupied by smaller, Didn’t mixed and disorderly of cables, use of one-button control, the ease of operation。

The height of Top heating head may adjust by rotating the handle. The Top Infrared heater could rework BGA ICs of large size up to 70*70mm. The top& bottom temperature areas heat independently testing temperature, senstive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring. The techology of closed-loop temperature control ensures accurate temperature process and even heat distribution.

The Linear guide type Bracket for BGA Reworks can be locked,adjusted by rotating the handle, It can fix PCB board easily, effectively prevent PCB board from deformation. IR 6000 can be connected to a computer with a built-in PC RS232 serial port. It can be controlled by the software. it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

The innovative design gets over the problem of ir heating rework station heating slowly and disorderly caused by the air flow. It can easy deal with the solder free soldering. The max temperature is up to 400 °C. It can easily deal with lead –free soldering work.


Products apply to CBGA,CCGA,CSP,QFN,MLF,PGA and all the green epoxy type μBGA chip Welding and other special parts like metal shielding cover, plastic connector,replacement of various,soft pcb etc.

Machine with Use Manual and live video demonstration CD-ROM, the information easy to understand, combined with the platform ease of use, even if you have never engaged in BGA rework can be quickly mastered the technology.



The parameters of LY IR6000 BGA Rework Station


Basic Parameters

Heating: IR
Dimension: L 475mm×W480mm×H420 mm
Weight: 15kg
Total weight: About 17 kg, vary with the differen need of the users


Electrical Parameters

Power: 220VAC
Upper Heating: IR
Size of Upper heating: 80mm×80 mm
Consumption of upper heating: 450W
Bottom Heating: IR
Size of Bottom heating: 180 mm×180 mm
Consumption of Bottom heating: 800W
General power: 1250W


Temperature Control

Control mode of Upper: Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, Alarm
Control mode of Bottom: Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, NO Alarm


Rework Function

SMD: Suit for welding, remove or repair packaged devices such as BGA,
PBGA,CSP,multi-layer substrates,
EMI metallic shield product and solder/lead free Rework ,welding
Size of applicable chips: ≤70mm×70 mm
Size of applicable PCB: ≤400mm×305 mm



Power: 1250W
Voltage: 220V 50 / 60 HZ
Weight: Appox 18KGs
Size: 475 mm×480 mm×420 mm


Add to Cart:

  • Model: LY IR 6000
  • Shipping Weight: 18kg
  • 19 Units in Stock