High Thermal Conductivity Low Bleed Stable
Uses: Thermal Coupling of Electrical Device to Heatsinks
Thermal Conductivity: >1.829 W/m-k
Thermal Resistance: <0.123°C-in²/W
20% Metal Oxide Compound
For CPU Cooler Use
N. W. 1.0 Gram
Note: The paste cannot be shipped by DHL, have to ship by EMS or air mail.