Description:
Tin(Sn):63%
Lead(Pb):37%
Flux:1.0-3.0%
CI(Flux):<0.1%
Expansion:75%
They have been treated by a special technology with oxide removal and antioxidant bearing, have less oxide residues after melting, antioxide performance and excellent solder ability,satisfyingly usded in wave and iron soldering processes with bright and full soldering points.
